Substrate transport mechanism and substrate transport method

TW202636892APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115118858
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-09-06
Filing Date
2022-02-11
Publication Date
2026-09-01

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Abstract

[Problem] When a substrate is received by a substrate transport mechanism in a laminated processing module, particle adhesion to the substrate can be suppressed, and substrate transport can be performed over a wide range. [Solution] A substrate transport mechanism is provided for processing substrates and receiving the substrates in each of a plurality of laminated processing modules, comprising: a base having a first drive mechanism; a lifting section for raising and lowering the base; a first arm extending laterally from the lower side of the base, the front end of which rotates about a longitudinal axis relative to the base by the first drive mechanism; a second arm extending laterally from the upper side of the front end of the first arm, the front end of which rotates about a longitudinal axis relative to the first arm along with the rotation of the first arm; and a substrate holding section provided on the upper side of the front end of the second arm and rotating about a longitudinal axis relative to the second arm.
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