Substrate processing device

TW202636894APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115120240
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-06-30
Filing Date
2022-05-26
Publication Date
2026-09-01

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Abstract

A substrate processing apparatus for processing substrates includes an inner chamber for receiving the substrate, an outer chamber disposed outside the inner chamber, and a processing gas supply unit for supplying processing gas to the interior of the inner chamber. The inner chamber is configured to be detachable from the outer chamber, and the outer chamber is configured to not come into contact with the processing gas supplied to the interior of the inner chamber. none
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