Integrated System and Maintenance Methods

TW202636899APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114143240
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-10-31
Filing Date
2025-11-06
Publication Date
2026-09-01

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Abstract

The integrated system of the present invention includes a substrate processing system, a maintenance device, and at least one control circuit. The substrate processing system includes a vacuum transfer module and a plurality of process modules. The vacuum transfer module includes a vacuum transfer chamber. Each of the plurality of process modules includes a processing chamber connected to the vacuum transfer chamber. The maintenance device has a transfer robot configured to be detachably connected to the vacuum transfer chamber for maintaining the substrate processing system. At least one control circuit is configured to control the maintenance device to use the transfer robot to move a magnetically levitated mobile device between the vacuum transfer chamber and the maintenance device.
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