Semiconductor manufacturing apparatus, substrate holding apparatus, substrate holding method, and method for manufacturing semiconductor devices

Abstract

[Problem] To provide a technique for pressing the periphery of a substrate to accommodate various substrate sizes. [Solution] A semiconductor manufacturing apparatus includes: a pair of slides for transporting substrates; a mounting section for supporting the substrates from below; a first pressing member disposed near one of the pair of slides, which presses the substrates against the mounting section by moving downwards; and a second pressing member disposed near the other of the pair of slides, movable in a width direction slightly perpendicular to the transport direction of the substrates, and which presses the substrates against the mounting section by moving downwards.

Images