Substrate processing apparatus and substrate processing method

TW202636904APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114149034
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-24
Filing Date
2025-12-15
Publication Date
2026-09-01

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Abstract

The present invention addresses the problem of a substrate processing apparatus and method capable of highly accurate detection of the position of a notch in a substrate. As a solution to the aforementioned problem, the substrate processing apparatus of the present invention comprises: a rotating holding unit configured to hold and rotate a substrate having a notch; an imaging unit configured to capture images of the substrate held in the rotating holding unit; and a control unit. The control unit is configured to perform: a first process, controlling the imaging unit to capture multiple images of the entire substrate while the substrate held in the rotating holding unit is stationary, by changing the imaging conditions from the same imaging position, thereby acquiring multiple images including the entire substrate; a second process, setting processing areas in different regions for each of the multiple images according to the imaging conditions; and a third process, performing image processing on the processing areas of each of the multiple images to detect the position of the notch in the substrate.
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