electrostatic chuck

Abstract

The objective of this invention is to provide an electrostatic chuck that can suppress uneven in-plane temperature distribution of a substrate. The solution of this invention is an electrostatic chuck 10, comprising: a dielectric substrate 100 having a mounting surface 110; an RF electrode 140 disposed within the dielectric substrate 100; a base plate 200 formed of metal and bonded to the dielectric substrate 100; and a conductive member 400 electrically connecting the RF electrode 140 and the base plate 200. A portion of the conductive member 400 is housed in a first recess 160 formed on a surface 120 of the dielectric substrate 100 on the side of the base plate 200. The end portion of the conductive member 400 on the side of the base plate 200 abuts against a surface 210 of the base plate 200 on the dielectric substrate 100 side, or abuts against the bottom surface 262 of a second recess 260 formed on the recess 210 and shallower than the first recess 160.

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