Ceramic substrate, semiconductor device package, electrostatic chuck, and substrate fixing device

TW202636913APending Publication Date: 2026-09-01SHINKO ELECTRIC IND CO LTD
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Patent Information

Application Number
TW114148558
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-12
Filing Date
2025-12-11
Publication Date
2026-09-01

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Abstract

A ceramic substrate includes a base body made of ceramic to which an inorganic component other than aluminum oxide is not added, and a conductor layer in contact with the base body. The conductor layer includes a first layer that is a sintered body mainly composed of metal and including aluminum oxide, a second layer that is a sintered body stacked on the first layer, mainly composed of metal, and not including aluminum oxide, and a third layer that is a sintered body stacked on the second layer, mainly composed of metal, and including aluminum oxide.
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