electrostatic chuck assembly

Abstract

This invention provides an electrostatic chuck assembly that minimizes spatial discharge within a gas-passing plug. The electrostatic chuck assembly includes: a ceramic plate having a top surface for mounting a wafer and a bottom surface opposite the top surface, and internal electrodes built into it as ESC electrodes and / or RF electrodes; a cooling plate mounted on the bottom surface of the ceramic plate; a plug mounting hole extending from the bottom surface to the top surface of the ceramic plate; a gas-passing plug configured to close the plug mounting hole while allowing gas to pass through; and a gas inlet passage disposed within the cooling plate and communicating with the plug mounting hole. At least a portion of the surface within the gas-passing plug that comes into contact with the gas is made of a low-SEEC material having a secondary electron emission coefficient (SEEC) of 5.0 or less.

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