Substrate support and substrate processing apparatus
TW202636919APending Publication Date: 2026-09-01THE UNIV OF TOKYO +1
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Patent Information
- Application Number
- TW114142669
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-11
- Filing Date
- 2025-11-03
- Publication Date
- 2026-09-01
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Abstract
A substrate support includes: a fixed-side member; and a movable-side member movable relative to the fixed-side member. The movable-side member has: a first platform having a support surface for supporting the substrate; and a first electrode disposed within the first platform. The fixed-side member has: a second platform disposed below the first platform, forming a gap with the first platform; and a second electrode disposed within the second platform. The first electrode and the second electrode are electrically coupled via an ionic liquid disposed in the gap. The ionic liquid contains conductive microparticles.
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