electrostatic chuck assembly

Abstract

This invention provides an electrostatic chuck assembly that, even with a gas-passing plug, does not easily experience surface discharge at the interface between the gas-passing plug and the ceramic plate. The electrostatic chuck assembly comprises: a ceramic plate having an upper surface for mounting a wafer and a lower surface facing the upper surface, and internal electrodes, which are ESC electrodes and / or RF electrodes, are built into it; a cooling plate is mounted on the lower surface of the ceramic plate; a plug mounting hole extends through the ceramic plate from the lower surface to the upper surface; a gas-passing plug is pressed into the plug mounting hole and configured such that gas can pass through internally; and a gas inlet passage is disposed within the cooling plate and communicates with the plug mounting hole. At least one side of the gas-passing plug and the plug mounting hole is made of a low-SEEC material having a secondary electron emission coefficient (SEEC) of 5.0 or less.

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