Substrate processing device
TW202636923APending Publication Date: 2026-09-01SHIBAURA MECHATRONICS CORP
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Patent Information
- Application Number
- TW115103906
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-27
- Filing Date
- 2026-02-02
- Publication Date
- 2026-09-01
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Figure TWG2TA001075238_001 
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Abstract
The present invention provides a substrate processing apparatus that can improve the circumferential temperature uniformity of a substrate. The substrate processing apparatus (1) of the embodiment includes: a rotation holding section (10) for rotating a substrate (W) held on a holding member (12); a processing liquid supply section (20) for supplying processing liquid (Lp) to the upper surface of the rotating substrate (W); and a heating section (50) for irradiating heating light from above the upper surface of the substrate (W) and transmitting light through at least the portion of the holding member in contact with the substrate (W).
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