Semiconductor process chamber and its base component

Abstract

This application discloses a semiconductor process chamber and its base component, belonging to the field of semiconductor technology. The base assembly includes a base body, which comprises a substrate and a top cover. The top cover is of an integrated structure and is provided with a wafer support surface. The substrate is located on the side of the top cover opposite to the wafer support surface, and the side of the top cover opposite to the wafer support surface is connected to the substrate. The semiconductor process chamber includes a chamber body and the aforementioned base component, with the base component installed in the chamber body. With this arrangement, the seam between the substrate and the top cover is restricted to the side of the top cover opposite to the wafer support surface, thereby preventing particles from being generated at the seam and affecting the wafer during processing, which is beneficial for improving process performance. Furthermore, the fasteners connecting the substrate and the top cover are positioned on the side opposite to the wafer support surface, so the installation holes for the fasteners are located far from the wafer support surface.

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