Substrate processing method, monitoring method of substrate processing, program, and substrate processing apparatus

Abstract

A substrate processing method according to one aspect of the invention includes a step of subjecting a substrate to predetermined processing that includes rotating the substrate held by a substrate holding section, and a step of repeatedly executing a monitoring process during execution of the predetermined processing. The monitoring process includes a first process which detects the outer edges within an image obtained by capturing a range that includes the outer edges of the surface of the substrate, a second process which calculates the position of the outer edges inside the image based on the detection results of the first process, and a third process which determines the presence or absence of anomalies associated with the holding of the substrate by the holding section based on the calculation results of the second process.

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