Semiconductor manufacturing apparatus, semiconductor apparatus inspection apparatus, semiconductor apparatus inspection method, and semiconductor apparatus manufacturing method

TW202636929APending Publication Date: 2026-09-01FASFORD TECH
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Patent Information

Application Number
TW114147789
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-20
Filing Date
2025-12-05
Publication Date
2026-09-01

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Abstract

[Problem] To provide a technology that can reduce product defects in a semiconductor manufacturing apparatus. [Solution] A semiconductor manufacturing apparatus includes: a platform on which a die is mounted; an imaging device on which an image is captured on the platform of the die; and a control device configured to perform image processing on the image data captured by the imaging device to inspect the surrounding area of ​​the die using brightness values.
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