Processing method and processing system

TW202636948APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115118568
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-11-02
Filing Date
2022-10-20
Publication Date
2026-09-01

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Abstract

A processing method for processing a composite substrate in which a first substrate and a second substrate are joined together, the method including a step of irradiating an interface laser onto the interface between the first substrate and the second substrate to form an unjoined region in which the join strength between the first substrate and the second substrate has been weakened, a step of inspecting the formation state of the unjoined region, a step of forming a peripheral reformed layer along the boundary between a peripheral section of the first substrate and a center section of the first substrate, and a step of removing the peripheral section at the peripheral reformed layer, wherein the inspection of the formation state of the unjoined region includes a step of using a camera to capture an image of the unjoined region, a step of acquiring a distribution of grey values of the unjoined region in plan view from the image captured of the unjoined region, and a step of examining the formation state of the unjoined region by comparing the acquired gray values against a predefined threshold.
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