Installation device

TW202636952APending Publication Date: 2026-09-01TORAY ENG CO LTD

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Patent Information

Application Number: TW114152106
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-02-27
Filing Date: 2025-12-31
Publication Date: 2026-09-01

Application Information

Patent Timeline

27 Feb 2025

Priority

31 Dec 2025

Application

TW114152106

01 Sep 2026

Publication

TW202636952A

IPC: H10P95/90; H05K13/04; H10W80/00

Inventors: 秦章浩; 松井祐樹

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Abstract

This disclosure discloses a method for measuring the temperature of a substrate in a laser mounting apparatus. Specifically, the mounting apparatus 1 includes: a wafer holding section 10 that holds a wafer C and mounts the wafer C onto a substrate W; an irradiation section 20 that irradiates a laser L; and a thermometer 30 that measures the temperature T of the substrate W. The laser L irradiates the substrate W from the irradiation section 20 through the wafer holding section 10. The thermometer 30 measures the temperature T of the substrate W by detecting the thermal radiation R emitted from the substrate W.

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