Memory device configured for detecting a connection failure between signal paths

TW202636957APending Publication Date: 2026-09-01SK HYNIX INC
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Patent Information

Application Number
TW114137254
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-26
Filing Date
2025-09-26
Publication Date
2026-09-01

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Abstract

A memory device includes a base chip and a core chip that are stacked through a signal path. The base chip and the core chip drive the signal path after the start of a scan operation and detect a connection fail of the signal path based on a logic level at which an internal node that is connected to the signal path is driven. The base chip adjusts timing at which the logic level of the internal node is latched.
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