Method of manufacturing electronic device

TW202636961APending Publication Date: 2026-09-01ADVANCED SEMICON ENG INC
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Patent Information

Application Number
TW115105225
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-26
Filing Date
2026-02-10
Publication Date
2026-09-01

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Abstract

The present disclosure provides a method of manufacturing an electronic device. The method includes providing a panel assembly including a plurality of first electronic components, dividing the panel assembly into a plurality of strips, forming a first encapsulant over one of the plurality of strips, and dividing the one of the plurality of strips into a plurality of electronic devices.
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