High conductivity and heat-dissipating chip and manufacturing method thereof

Abstract

A highly conductive and heat-dissipating chip and a manufacturing method thereof. The manufacturing method of a highly conductive and heat-dissipating chip includes: providing a substrate disposed on a carrier; grinding a second surface of the substrate; sputtering a seed layer onto the second surface of the substrate; electroplating a metal material onto the seed layer corresponding to the second surface to form a metal layer; and debonding the substrate from the carrier. This method enhances the heat dissipation effect of the substrate, protects the substrate structure, and extends the service life of the substrate.

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