A heat spreader material and a system single-chip containing the same.
TW202636967APending Publication Date: 2026-09-01宋健民
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Patent Information
- Application Number
- TW114106260
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-09-01
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Abstract
A heat spreader material, wherein the heat spreader material is a transparent or partially transparent silicon carbide wafer or a slice of the silicon carbide wafer, the heat spreader material serving as an insulating layer of a wafer, wherein the silicon carbide wafer or the slice has a thermal conductivity higher than that of copper.
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