Semiconductor device
TW202636968APending Publication Date: 2026-09-01SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW115106235
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-09-17
- Filing Date
- 2026-02-13
- Publication Date
- 2026-09-01
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Figure TWG2TA001075314_003
Abstract
Semiconductor devices and methods of manufacturing the semiconductor devices are provided. For example, a semiconductor device may include: a stack of semiconductor layers including a first semiconductor layer, and a second semiconductor layer stacked on the first semiconductor layer in a first direction; a heat sink stacked on the second semiconductor layer in the first direction; and a heat pipe that extends in the first semiconductor layer, the second semiconductor layer, and the heat sink in the first direction.
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