Low-profile submodule for multi-level system-in-package integration

Abstract

The present disclosure relates to a multi-level system-in-package (SIP) module featuring at least one low-profile submodule, and a process for manufacturing the same. In the disclosed multi-level SIP module, the submodule and top components are attached to a top side of the module substrate. The submodule includes submodule components, submodule bumps, and a submodule substrate having a laminate body and metal layers. One of the metal layers protrudes vertically from a boundary surface of the laminate body, while another one of the metal layers is embedded in the laminate body and shares a flat plane with the laminate body. The submodule components and the submodule bumps are mounted on opposite sides of the submodule substrate via corresponding ones of the metal layers, respectively. Additionally, the submodule bumps extend towards the top side of the module substrate to provide a stand-off space vertically between the submodule substrate and the module substrate.

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