Advanced package assembly and method of forming the same

Abstract

The present disclosure relates to methods of forming interconnects to bond package assemblies together. In one embodiment, copper interconnects are used to bond a package assembly having an organic substrate core to other package assemblies or electronic devices having substrate cores which may include organic cores or inorganic cores, such as silicon, glass, or silicon carbide. In another embodiment, copper interconnects are used to bond a package assembly having an organic substrate core to other package assemblies having organic substrate cores. In another embodiment, a semiconductor package assembly comprising copper or copper alloy interconnects, as herein described.

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