Methods for manufacturing substrates with conductive pillars and methods for manufacturing substrates with solder bumps

Abstract

A method for manufacturing a substrate with conductive pillars includes: step S1, preparing a substrate with a metal sintered body, the substrate having a metal sintered body comprising a substrate, a columnar metal sintered body disposed on the substrate and having a porous structure, and a resist layer disposed to seal the metal sintered body and expose at least one end face of the metal sintered body opposite to the substrate; and step S2, providing a resin-containing portion containing a photosensitive resin composition or a cured product thereof on the metal sintered body of the substrate having the metal sintered body.

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