Semiconductor modules and their manufacturing methods

Abstract

[Problem] To improve the performance of a semiconductor module. [Solution] A semiconductor module 100 includes: a semiconductor die 10; a semiconductor die 20; a bridge die 30; a plurality of external terminals 40; a bridge-side seal 51 that seals the bridge die 40 and the plurality of external terminals 40; and a conductor layer 60 formed on the bridge-side seal 51. The conductor layer 60 includes: a connection portion 61 electrically connected to the die electrode 11A of the semiconductor die 10 and the bridge electrode 31A of the bridge die 30; a connection portion 62 electrically connected to the die electrode 21B of the semiconductor die 20 and the bridge electrode 31B of the bridge die 30; and a bridge wiring 63 electrically connected to the bridge electrode 31C of the bridge die 30 and a portion of the plurality of external terminals 40.

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