Electronic device

Abstract

This application provides an electronic device and a method of forming the same. The method includes: providing a packaging substrate; forming a bridging intermediate within the packaging substrate and exposing a top surface of the bridging intermediate from the packaging substrate; attaching a stepped intermediate to the top surface of the bridging intermediate, wherein the stepped intermediate has a stepped structure on one side; mounting a bottom semiconductor die on the packaging substrate, the bottom semiconductor die being adjacent to the stepped intermediate; mounting one or more upper semiconductor dies on the stepped structure of the bottom semiconductor die and the stepped intermediate to electrically couple each of the upper semiconductor dies to the bridging intermediate via the stepped intermediate; mounting an electronic component on the top surface of the bridging intermediate to electrically couple the electronic component to one or more upper semiconductor dies via the bridging intermediate and the stepped intermediate; and forming a mold cap on the packaging substrate.

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