Package comprising a device with a capacitor comprising vertically aligned capacitor interconnects

Abstract

A package comprising a package substrate comprising at least one dielectric layer; a plurality of interconnects; a passive device located at least partially in the at least one dielectric layer, wherein the passive device comprises a bridge comprising a plurality of bridge interconnects; and a capacitor comprising a plurality of capacitor interconnects that are vertically aligned; and an integrated device coupled to the package substrate.

Images