Package structure

TW202636987APending Publication Date: 2026-09-01ADVANCED SEMICON ENG INC
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Patent Information

Application Number
TW115103511
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-20
Filing Date
2026-01-29
Publication Date
2026-09-01

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Abstract

A package structure includes a substrate, a redistribution layer (RDL) structure, a first electronic component and a second electronic component. The RDL structure is disposed on the substrate. The first electronic component is disposed over the RDL structure. The second electronic component is disposed over the RDL structure. The first electronic component is electrically communicated with the second electronic component through the substrate and the RDL structure. A number of input / output (I / O) count of the RDL structure is less than a number of I / O count of the substrate.
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