Package and method of making package

Abstract

Methods for self-alignment for die stacking are disclosed. In one aspect, magnets are added to wafers in a predefined grid. Complementary magnets in dice to be placed on the wafer are attracted to the magnets in the wafer, causing the dice to be positioned and aligned in a desired location on the wafer. Conventional bonding techniques may then be used to secure the dice to the wafer. While plural dice are contemplated, the present disclosure also contemplates a single die being attached to a wafer using this technique. The creation of the magnets may be done using preformed magnets or by placing magnetic material in the wafers and generating a magnet using an electromagnetic field.

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