Die-bonding apparatus, die-bonding method and method for manufacturing semiconductor devices

Abstract

[Problem] To provide a technique that can improve the accuracy of die bonding position. [Solution] A die bonding apparatus includes: a first camera device disposed between a pickup position and a bonding position, capable of capturing images of a die held by a collet from below; a second camera device disposed at the bonding position, capable of capturing images of the die held by the collet and a substrate from above; and a control unit. The control unit is configured to perform the following operations: (a) measuring the positional relationship between a calibration mark provided on the die and the die shape captured by the first camera device; (b) measuring the positional relationship between a reference mark provided on the substrate and the die shape captured by the second camera device; (c) determining the positional relationship between the calibration mark and the reference mark based on the positional relationship between the calibration mark and the die shape, and the positional relationship between the reference mark and the die shape, thereby aligning the calibration mark and the reference mark.

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