Joining device, joining method and joining system

Abstract

[Problem] The present invention aims to provide a technique to improve the bonding quality of a die to a target substrate. [Solution] A bonding apparatus is provided for a die having a bonding surface and a non-bonding surface in the opposite direction to the bonding surface, wherein the bonding surface of the die is aligned with the bonding surface of the target substrate, thereby bonding the die to the target substrate. The bonding apparatus includes: a substrate stage for holding the target substrate; a first adsorption head for adsorbing a portion of the non-bonding surface of the die; a first moving mechanism for moving the die together with the first adsorption head and pressing the die onto the target substrate; a pressure head for pressing another portion of the non-bonding surface of the die; and a second moving mechanism for moving the pressure head independently of the first adsorption head and pressing the die onto the target substrate.

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