Semiconductor processing method

TW202636998APending Publication Date: 2026-09-01POWERCHIP SEMICON MFG CORP
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Patent Information

Application Number
TW114107081
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-26
Publication Date
2026-09-01

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Abstract

A semiconductor processing method including the following steps is provided. A first wafer and a second wafer bonded to each other is provided. There is a gap between the edge of the first wafer and the edge of the second wafer. The gap is filled with protective glue. After the gap is filled with the protective glue, a grinding process is performed on one of the first wafer and the second wafer.
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