Package substrate and fabricating method thereof
TW202637007APending Publication Date: 2026-09-01AALTOSEMI INC
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Patent Information
- Application Number
- TW114108729
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-17
- Filing Date
- 2025-03-10
- Publication Date
- 2026-09-01
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Figure TWG2TA001074128_001 
Figure TWG2TA001074128_002 
Figure TWG2TA001074128_003
Abstract
A packaging substrate is made by forming a circuit structure on a core layer with conductive pillars, and forming a support structure in the core layer and in the circuit structure, and the support structure corresponds to the peripheral area of the core layer, so the support structure can effectively suppress the delamination of the circuit structure.
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