Semiconductor substrate processing method and system

Abstract

A method for processing a semiconductor substrate includes: providing a substrate. A plurality of micro- holes are opened on the substrate. A plurality of micro conductive pillars are arranged on the temporary carrier. The micro conductive pillar is placed in the micro- hole. Apply conductive glue on the first surface so that the conductive glue fills the gap between the micro conductive pillar and the corresponding micro- hole. Remove the temporary carrier. Grind both surfaces of the substrate so that the two side-surfaces of the micro-conductive pillar are flush with the surfaces of the substrate respectively. Coating a photoresist layer, exposing the photoresist layer and developing the photoresist layer are performed. A plurality of openings are opened in the photoresist layer, corresponding to the micro-conductive pillars. A conductive layer is plated in the opening. Peel off the remaining photoresist layer. A system for processing semiconductor substrates is also provided.

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