Manufacturing method for reinforcing semiconductor wafers, semiconductor wafers with films, methods for reinforcing semiconductor wafers, reinforcing films and semiconductor devices.

TW202637011APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information

Application Number
TW115116340
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-11-05
Filing Date
2022-10-20
Publication Date
2026-09-01

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    Figure TWG2TA001075365_002
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    Figure TWG2TA001075365_003
Patent Text Reader

Abstract

This invention discloses a method for manufacturing a reinforced semiconductor wafer. The method includes the step of depositing a film having at least a thermosetting resin layer on the surface of a single-layer or multi-layer semiconductor wafer.
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