Electronic package and manufacturing method thereof

TW202637012APending Publication Date: 2026-09-01SILICONWARE PRECISION IND CO LTD
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Patent Information

Application Number
TW114105754
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-17
Publication Date
2026-09-01

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Abstract

The present invention provides an electronic package and a manufacturing method thereof, which mainly provides a first electronic component, then performs a first molding process to form a first coating layer covering the first electronic component, and then performs a second molding process to form a second coating layer covering the first coating layer, wherein the shrinkage direction of the second coating layer is opposite to the warping direction of the first coating layer, so as to solve the problem of structural warping caused by shrinkage of conventional molding material.
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