Oversized silicon device using diamond for heat dissipation and manufacturing method thereof

Abstract

The invention provides an oversized silicon device using diamond for heat dissipation and a manufacturing method thereof. The manufacturing method includes: Cleans and dry a single crystal silicon wafer at room temperature. Preprocess a single crystal silicon wafer with seed crystal so that a silicon surface covered by a layer of diamond nanocrystal layer, and places the single crystal silicon wafer in the MPCVD equipment. Evacuates a chamber of MPCVD equipment, then aerates hydrogen into the chamber, and then evacuates the chamber again. Aerates hydrogen in the chamber and adjusts pressure to

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