Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device comprises a substrate comprising a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure, a first electronic component over the first side of the substrate, wherein the first electronic component comprises an image component at a first side of the first electronic component facing away from the substrate, and an encapsulant over the first side of the substrate and over the first side of the first electronic component. The encapsulant defines a cavity over the first side of the first electronic component, and the image component is exposed in the cavity. The electronic device further comprises an interconnect in the encapsulant and coupled with the first electronic component and the conductive structure, and a lid over the cavity and covering the image component. Other examples and related methods are also disclosed herein.

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