Bonding apparatus and method of performing bonding processes

TW202637020APending Publication Date: 2026-09-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114116382
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-17
Filing Date
2025-04-30
Publication Date
2026-09-01

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Abstract

An apparatus is provided. The apparatus includes a first chase configured to support a plurality of items to be bonded together in a bonding process. The apparatus includes a second chase over the plurality of items. At least one of the first chase or the second chase is configured to apply a pressing force to the plurality of items during the bonding process. The apparatus includes a liquid cooling module configured to conduct, after the bonding process, a liquid through a cooling channel to cool at least one of the first chase or the second chase.
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