Semiconductor storage devices

Abstract

This invention provides a semiconductor storage device comprising a plurality of semiconductor wafers stacked on top of each other, and having a novel structure different from the prior art. The semiconductor storage device includes memory wafers 1-1 and 1-2 stacked on top of each other. Memory wafers 1-1 and 1-2 include circuit elements and wiring arranged in the same layout between memory wafers 1-1 and 1-2. Each memory wafer 1-1 and 1-2 has a surface and a back surface facing each other, and a plurality of first terminals disposed on the surface. In each of memory wafers 1-1 and 1-2, the plurality of first terminals are arranged in a mirror-symmetric configuration about a plane of symmetry orthogonal to the surface and back surface. Memory wafers 1-1 and 1-2 are stacked such that the surface of memory wafer 1-1 is in contact with the surface of memory wafer 1-2, and the plurality of first terminals of memory wafer 1-1 are connected to the plurality of first terminals of memory wafer 1-2.

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