Copper paste for bonding

Abstract

This invention provides a copper paste for bonding, which exhibits excellent low-temperature sintering properties and bonding strength with the bonded object. The copper paste for bonding comprises a solvent, an additive, and copper powder. The additive comprises an amine-based organic compound with a mass-average molecular weight of 1000 or less. The solvent has a boiling point of 100°C or higher and 300°C or lower, and comprises a glycol-based solvent. The copper powder is copper powder with a number-average particle size of 30 nm or higher and 180 nm or lower calculated from the equivalent circle diameter, and its surface is coated with a surface coating containing an organic substance satisfying conditions (1) and (2). The Hansen solubility parameter of the copper powder coated with the surface coating is 7 or less from the Hansen solubility parameter of the aforementioned amine-based organic compound.

Images