Substrate processing method

Abstract

A method for processing a substrate is provided. The method comprises: providing a substrate having a first surface and an opposite second surface. A plurality of fine holes are opened on the substrate by laser, and each fine hole passes through the first surface and the second surface. Preparing an etching solution. The substrate is placed statically on the liquid surface of the etching solution so that the second surface contacts the liquid surface. Corresponding to each fine holes, the etching solution creeps and adheres to an inner wall surface of each pore, and laterally etches the inner wall surface, so that each pore forms a micro-hole.

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