Mid temperature ultra-high reliability solder alloys

TW202637311APending Publication Date: 2026-09-16ALPHA ASSEMBLY SOLUTIONS INC
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Patent Information

Application Number
TW114147663
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-06
Filing Date
2025-12-05
Publication Date
2026-09-16

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Abstract

wt.% aluminium, optionally one or more of: from greater than
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