Grinding head and grinding device

Abstract

This disclosure provides a polishing head and polishing apparatus for removing a film from a substrate surface. The polishing head includes: a polishing pad having a polishing surface and a through hole penetrating the polishing pad, the area of ​​the polishing pad being less than or equal to the area of ​​the substrate; and a liquid supply line connecting the through hole to an external liquid supply device to supply polishing liquid to the substrate surface. The polishing surface has radial guide grooves extending from the through hole to the edge of the polishing surface, and the polishing liquid flows from the through hole along the guide grooves to the edge of the polishing surface to form a liquid film between the polishing pad and the substrate.

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