Method of forming pads for chemical planarization

TW202637324APending Publication Date: 2026-09-16CHEMPOWER CORP
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Patent Information

Application Number
TW115120541
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-05-24
Filing Date
2024-05-24
Publication Date
2026-09-16

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Patent Text Reader

Abstract

A pad for performing abrasive-free chemical planarization of a substrate comprises a polymer layer configured to contact the substrate during the abrasive-free chemical planarization. The polymer layer comprises a plurality of reactive units covalently bonded within polymer chains. Each reactive unit comprises a functional group comprising one or more of a complexing agent or a hydrolyzing agent for performing the abrasive-free chemical planarization.
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