Polishing method and polishing apparatus

Abstract

[Problem] To provide a technology that can stabilize the pressure control of the grinding head when the grinding rate changes significantly during the grinding of workpieces such as wafers. [Solution] The grinding method includes: during the grinding of workpiece W, calculating a plurality of grinding rates for a plurality of regions on the surface of workpiece W, detecting a plurality of change points of the plurality of grinding rates, and before detecting the plurality of change points of the plurality of grinding rates, the grinding head 1 performs a grinding amount control action to grind the plurality of regions of workpiece W with the same grinding amount, and after detecting the plurality of change points of the plurality of grinding rates, the grinding head 1 performs a contour control action to grind the contour of the plurality of regions of workpiece W, so that the film thickness contour of workpiece W reaches the target film thickness contour.

Images