Conditioner and manufacturing method thereof
TW202637328APending Publication Date: 2026-09-16YTDIAMOND
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Patent Information
- Application Number
- TW115105572
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-14
- Filing Date
- 2026-02-12
- Publication Date
- 2026-09-16
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Figure TWG2TA001077194_001 
Figure TWG2TA001077194_002 
Figure TWG2TA001077194_003
Abstract
A conditioning assembly and its manufacturing method. The conditioning assembly includes a base and a grinding structural member. The grinding structural member includes a support structure layer, a first bonding layer, a plurality of abrasive particles, a second bonding layer, and an infiltration composite layer. The support structure layer has a first surface and a second surface opposite to each other. The first bonding layer is disposed on the first surface. The plurality of abrasive particles are disposed on the first surface in a single-layer arrangement, and the plurality of abrasive particles are bonded to the support structure through the first bonding layer. The second bonding layer is disposed on the second surface. The infiltration composite layer is disposed on the second surface and is bonded to the support structure through the second bonding layer. The base and the grinding structural member are bonded together through a third bonding layer.
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