Manufacturing methods and molds for wafers and optical components

TW202637353APending Publication Date: 2026-09-16SONY SEMICON SOLUTIONS CORP
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Patent Information

Application Number
TW114150942
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-11-25
Filing Date
2025-12-24
Publication Date
2026-09-16

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Abstract

In a method for manufacturing optical components, multiple small optical components are manufactured in a single molding process. The wafer of this invention includes a gate, a runner, an optical component arrangement section, and a plurality of optical components. In this wafer, the gate is disk-shaped. Furthermore, in the wafer, the runner extends from the center of the gate along its central axis. Furthermore, in the wafer, the optical component arrangement section is an annular component surrounding the gate and without runners. Furthermore, a plurality of optical components are arranged in the optical component arrangement section.
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