Processing of copper foil, laminates and their manufacturing methods

Abstract

This invention provides a processed copper foil that can be firmly bonded to a substrate on a smooth and uneven interface. Furthermore, this invention provides a laminate that firmly bonds the substrate and the processed copper foil on a smooth and uneven interface, and a method for manufacturing the same. It has been found that by using a processed copper foil on a copper foil (A) with a conductive layer (B) containing silver (b1) laminated thereon, a firm bond can be achieved between the copper foil (A) and the substrate (D) on a smooth and uneven interface, thus completing this invention.