Laminated bodies and metal-clad laminates

Abstract

A metal-clad laminate is provided, suitable for use as a material for printed circuit boards (PCBs), exhibiting excellent dimensional stability and reduced transmission loss when used in PCB manufacturing. A laminate is also provided as an intermediate for manufacturing the aforementioned metal-clad laminate, possessing a low coefficient of linear expansion and a low dielectric loss tangent. A PCB is provided for circuit fabrication on the aforementioned metal-clad laminate. The laminate sequentially comprises: a resin layer (B1), a layer containing glass cloth (A), and a resin layer (B2), wherein the dielectric loss tangent Df of the aforementioned resin layers (B1) and (B2) at 10 GHz is 0.0020 or less.

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